GIGABYTE B860 DS3H Motherboard - Supports Intel Core Ultra CPUs, 8+1+2+2 phases VRM, up to 9066MHz DDR5, 1xPCIe 5.0 + 1xPCIe 4.0 M.2, 2.5 GbE LAN, USB 3.2 Gen 2x2

GIGABYTE B860 DS3H Motherboard - Supports Intel Core Ultra CPUs, 8+1+2+2 phases VRM, up to 9066MHz DDR5, 1xPCIe 5.0 + 1xPCIe 4.0 M.2, 2.5 GbE LAN, USB 3.2 Gen 2x2B860 DS3H Motherboard Supports Intel Core Ultra CPUs, 8+1+2+2 phases VRM, up to 9066MHz DDR5, 1xPCIe 5. 0 + 1xPCIe 4. 0 M. 2, 2. 5 GbE LAN, USB 3. 2 Gen 2x2Key Features Hybrid 8+1+2+2 Phases 50A PPAK VRM Dual Channel DDR54*DIMMs PCIe 5. 0 x16 with PCIE UD Slot & EZ Latch M. 2 Gen5 (Up to 25110) with EZ Latch Plus MOSFET Heatsinks M. 2 Thermal Guard 2. 5GbE LAN, USB 3. 2 Gen2x2 Type C Q Flash Plus Description Elevate your computing experience with

GFSK Maximum data transfer rate 3 Mbit/s Bluetooth Yes Design Product colour Black

1") WUXGA 1920 x 1200 IPS

Ubuntu x86 64-bit Thermal Design Power (TDP) 200 W Market segment Desktop Launch date 4/22/26 Processor cache type L3 Features Maximum number of PCI Express lanes 28 Thermal Design Power (TDP) 200 W PCI Express slots version 5

- Intel® processing power to speed through tasks

}Intel® Ethernet Converged Network Adapter X710-T4Description

Our tests also include temperature

Remote volume control

35 V Design Backlight colour Red/Green/Blue Backlight Yes Cooling type Heatsink Technical details Country of origin Taiwan Cooling type Heatsink Memory Memory layout (modules x size) 2 x 16 GB Internal memory 32 GB Component for PC/Server Memory form factor 288-pin DIMM CAS latency 16 Memory voltage 1

5 Gigabit Ethernet Features Windows operating systems supported Windows 11 Motherboard chipset family Intel Motherboard chipset Intel H810 Audio output channels 7

for cutting-edge precision

TUV/GS Front bezel colour Black Sustainability compliance Yes Sustainability certificates ENERGY STAR

Jabra Sound+